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1. general description the PCF2120 is a cmos quartz oscillator optimized for low power consumption. the 32 khz output signal is gated using an enable signal. 2. features n clock operating voltage: 1.5 v to 5.5 v n low backup current: typical 0.85 m a at v dd = 3.0 v and t amb =25 c n 32.768 khz output for peripheral devices n two integrated oscillator capacitors n push-pull output n internal power-on reset 3. applications n portable instruments n industrial products n battery powered products 4. quick reference data [1] for reliable oscillator start-up at power-up: v dd >v dd(min) + 0.3 v. PCF2120 quartz oscillator rev. 01 5 february 2008 product data sheet table 1. quick reference data symbol parameter conditions min typ max unit v dd supply voltage [1] 1.5 - 5.5 v i dd supply current clock output disabled v dd = 2.0 v; t amb =25 c - 210 450 na v dd = 3.0 v; t amb = - 40 c to +85 c - 265 650 na clock output enabled at 32 khz v dd = 2.0 v; t amb =25 c - 615 900 na v dd = 3.0 v; t amb = - 40 c to +85 c - 875 1100 na t stg storage temperature - 65 - +150 c
PCF2120_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 5 february 2008 2 of 14 nxp semiconductors PCF2120 quartz oscillator 5. ordering information [1] packing method: sawn wafer on film frame carrier (ffc). 6. block diagram 7. pinning information 7.1 pinning table 2. ordering information type number package name description version PCF2120tk hvson10 plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 3 3 0.85 mm sot650-1 PCF2120u [1] - wire bond die; 7 bonding pads; 0.57 1.1 0.2 mm PCF2120u pin numbers shown for hsvon10 package. fig 1. block diagram 001aaf631 test v ss v dd osco osci clkout n.c. clkoe 10 3 2 5 79 8 1, 4, 6 c l(itg) PCF2120 fig 2. pin con?guration hvson10 package fig 3. pad con?guration wire bond die 001aaf628 PCF2120tk n.c. n.c. v ss test osco clkout osci v dd n.c. clkoe transparent top view 5 6 4 7 3 8 2 9 1 10 terminal 1 index area 001aah559 2 osco 1 osci 7 PCF2120u clkoe 6v dd 5 clkout 4 test 3 v ss
PCF2120_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 5 february 2008 3 of 14 nxp semiconductors PCF2120 quartz oscillator 7.2 pin description 8. functional description the 32 khz quartz oscillator is optimized for directly connecting to a 32 khz tuning fork quartz crystal. no additional tuning capacitors are required. laser tuning of the quartz or quartz selection for matching is used to tune the oscillator if required. a digital 32 khz signal is available on pin clkout. the signal on pin clkoe is used to gate and synchronize the 32 khz clkout signal. pin clkout is a cmos push-pull output. if disabled, it goes to low level. table 3. pin description symbol pin pad description hvson10 wire bond die n.c. 1 - not connected osci 2 1 oscillator input osco 3 2 oscillator output n.c. 4 - not connected v ss 5 3 ground n.c. 6 - not connected test 7 4 test pin clkout 8 5 clock output (push-pull) v dd 9 6 supply voltage clkoe 10 7 clock output enable input (1) osco-internal 32 khz signal: internal signal after the schmitt trigger connected to pin osco. fig 4. clkout output signal osco- internal 32 khz 001aaf633 (1) clkoe clkout
PCF2120_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 5 february 2008 4 of 14 nxp semiconductors PCF2120 quartz oscillator 9. internal circuitry 10. limiting values [1] human body model (hbm) according to jesd22-a114. [2] machine model (mm) according to jesd22-a115. [3] charged-device model (cdm) according to jesd22-c101. [4] latch-up testing according to jesd78. pin numbers shown for hsvon10 package. fig 5. device diode protection diagram 001aaf634 1 2 3 test clkout v dd clkoe 4 5 6 7 osci osco v ss PCF2120 table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v dd supply voltage - 0.5 +6.5 v i dd supply current - 50 +50 ma v i input voltage - 0.5 +6.5 v v o output voltage - 0.5 +6.5 v i i input current at any input - 10 +10 ma i o output current at any output - 10 +10 ma p tot total power dissipation - 300 mw t stg storage temperature - 65 +150 c v esd electrostatic discharge voltage hbm [1] - 2000 v mm [2] - 200 v cdm [3] - 2000 v i lu latch-up current [4] - 100 ma
PCF2120_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 5 february 2008 5 of 14 nxp semiconductors PCF2120 quartz oscillator 11. static characteristics [1] for reliable oscillator start-up at power-up: v dd >v dd(min) + 0.3 v. table 5. static characteristics v dd = 1.5 v to 5.5 v; v ss =0v; t amb = - 40 c to +85 c; f osc = 32.768 khz; quartz r s =40k w ; c l = 8 pf; unless otherwise speci?ed. symbol parameter conditions min typ max unit supply v dd supply voltage [1] 1.5 - 5.5 v i dd supply current clock output disabled t amb =25 c v dd = 5.0 v - 300 550 na v dd = 3.0 v - 235 500 na v dd = 2.0 v - 210 450 na t amb = - 40 c to +85 c v dd = 5.0 v - 345 750 na v dd = 3.0 v - 265 650 na v dd = 2.0 v - 230 600 na clock output enabled at 32 khz [2] t amb =25 c v dd = 5.0 v - 1310 1700 na v dd = 3.0 v - 845 1100 na v dd = 2.0 v - 615 900 na t amb = - 40 c to +85 c v dd = 5.0 v - 1385 1700 na v dd = 3.0 v - 875 1100 na v dd = 2.0 v - 635 900 na inputs pin osci v i input voltage - 0.5 - v dd + 0.5 v pin clkoe v i input voltage - 0.5 - v dd + 0.5 v v il low-level input voltage - - 0.3v dd v v ih high-level input voltage 0.7v dd -- v i li input leakage current v i =v dd or v ss - 10 +1 m a outputs pin osco v o - 0.5 - v dd + 0.5 v pin clkout v o output voltage - 0.5 - v dd + 0.5 v i ol low-level output current v ol = 0.4 v; v dd =5v - 1- - ma i oh high-level output current v oh = 4.6 v; v dd =5v --1 ma i lo output leakage current v o =v dd or v ss - 10 +1 m a
PCF2120_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 5 february 2008 6 of 14 nxp semiconductors PCF2120 quartz oscillator [2] pin clkout is loaded with a 7.5 pf capacitor. when pin clkout is enabled the current consumption is a function of the load on that pin, the output frequency and the supply voltage. the additional current consumption for a given load can be calculated from the formula i dd = c clkout v dd f clkout where: i dd = supply current c clkout = capacitance on pin clkout v dd = supply voltage f clkout = output frequency on pin clkout 12. dynamic characteristics [1] c l(itg) is the combined equivalent integrated oscillator input and output capacitances. table 6. dynamic characteristics v dd = 1.5 v to 5.5 v; v ss =0v; t amb = - 40 c to +85 c; f osc = 32.768 khz; quartz r s =40k w and c l = 8 pf; unless otherwise speci?ed. symbol parameter conditions min typ max unit oscillator c l(itg) integrated load capacitance [1] 6810pf d f osc /f osc relative oscillator frequency variation d v dd = 200 mv; t amb =25 c - 0.2 - ppm a. clkout disabled b. clkout enabled at 32 khz t amb =25 c. t amb =25 c. fig 6. supply current as a function of supply voltage 001aaf635 v dd (v) 06 4 2 0.4 0.6 0.2 0.8 1.0 i dd ( m a) 0 001aaf636 v dd (v) 06 4 2 0.8 1.2 0.4 1.6 2.0 i dd ( m a) 0
PCF2120_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 5 february 2008 7 of 14 nxp semiconductors PCF2120 quartz oscillator 13. application information you can mount the PCF2120 oscillator together with the quartz crystal as an accurate and pre-tuned quartz oscillator in one package. v dd = 3 v; clkout enabled at 32 khz fig 7. supply current as a function of ambient temperature t amb ( c) - 40 120 80 040 001aaf637 0.85 0.90 0.80 0.95 1.00 i dd ( m a) 0.75 (1) do not connect pin test; it is chip-internally connected. fig 8. application diagram 001aaf632 test (1) 10 nf osco 32 khz osci clkout clkoe v ss v dd PCF2120 c l(itg)
PCF2120_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 5 february 2008 8 of 14 nxp semiconductors PCF2120 quartz oscillator 14. package outline fig 9. package outline sot650-1 (hvson10) 0.5 0.2 1 0.05 0.00 a 1 e h b unit d (1) y e 2 e 1 references outline version european projection issue date iec jedec jeita mm 3.1 2.9 cd h 1.75 1.45 y 1 3.1 2.9 2.55 2.15 0.30 0.18 0.05 0.1 dimensions (mm are the original dimensions) sot650-1 mo-229 - - - - - - e (1) 0.55 0.30 l 0.1 v 0.05 w 0 2 mm 1 scale sot650-1 hvson10: plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 3 x 3 x 0.85 mm a (1) max. a a 1 c detail x y d h e h e l 10 5 1 6 d e y 1 c c b a 01-01-22 02-02-08 terminal 1 index area terminal 1 index area x e 1 b a c c b v m w m note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included.
PCF2120_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 5 february 2008 9 of 14 nxp semiconductors PCF2120 quartz oscillator 15. bare die outline 16. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 surface mount re?ow soldering description . fig 10. bare die outline PCF2120u references outline version european projection issue date iec jedec jeita PCF2120u wire bond die; 7 bonding pads; 0.57 x 1.1 x 0.2 mm PCF2120u 07-12-07 08-02-01 unit a mm 0.212 0.188 d 1.1 e 0.57 p 1 0.07 p 2 0.06 dimensions (mm are the original dimensions) 0 0.5 1 mm scale a detail x p 2 p 1 p 3 p 4 d e 1 2 3 45 6 7 bonding pad 1 corner x x y 0 0 p 3 0.07 p 4 0.06 p 1 and p 3 : pad size p 2 and p 4 : passivation opening table 7. bonding pad coordinates values x and y in m m. pad x y 1 +313 +187 2 +93 +187 3 - 236 +187 4 - 259 - 172 5 - 137 - 172 6 +127 - 172 7 +380 - 172
PCF2120_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 5 february 2008 10 of 14 nxp semiconductors PCF2120 quartz oscillator 16.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electrical circuits. the soldered joint provides both the mechanical and the electrical connection. there is no single soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for ?ne pitch smds. re?ow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 16.2 wave and re?ow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. the re?ow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature pro?le. leaded packages, packages with solder balls, and leadless packages are all re?ow solderable. key characteristics in both wave and re?ow soldering are: ? board speci?cations, including the board ?nish, solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivity level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 16.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhesive and ?ux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath speci?cations, including temperature and impurities 16.4 re?ow soldering key characteristics in re?ow soldering are: ? lead-free versus snpb soldering; note that a lead-free re?ow process usually leads to higher minimum peak temperatures (see figure 11 ) than a snpb process, thus reducing the process window
PCF2120_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 5 february 2008 11 of 14 nxp semiconductors PCF2120 quartz oscillator ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? re?ow temperature pro?le; this pro?le includes preheat, re?ow (in which the board is heated to the peak temperature) and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classi?ed in accordance with t ab le 8 and 9 moisture sensitivity precautions, as indicated on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during re?ow soldering, see figure 11 . table 8. snpb eutectic process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 3 350 < 2.5 235 220 3 2.5 220 220 table 9. lead-free process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 msl: moisture sensitivity level fig 11. temperature pro?les for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature
PCF2120_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 5 february 2008 12 of 14 nxp semiconductors PCF2120 quartz oscillator for further information on temperature pro?les, refer to application note an10365 surface mount re?ow soldering description . 17. revision history table 10. revision history document id release date data sheet status change notice supersedes PCF2120_1 20080205 product data sheet - -
PCF2120_1 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 01 5 february 2008 13 of 14 nxp semiconductors PCF2120 quartz oscillator 18. legal information 18.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 18.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 18.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. quick reference data the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding. bare die all die are tested on compliance with all related technical speci?cations as stated in this data sheet up to the point of wafer sawing for a period of ninety (90) days from the date of delivery by nxp semiconductors. if there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. there are no post-packing tests performed on individual die or wafers. nxp semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. accordingly, nxp semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. it is the responsibility of the customer to test and qualify their application in which the die is used. all die sales are conditioned upon and subject to the customer entering into a written die sale agreement with nxp semiconductors through its legal department. 18.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 19. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors PCF2120 quartz oscillator ? nxp b.v. 2008. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 5 february 2008 document identifier: PCF2120_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 20. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 quick reference data . . . . . . . . . . . . . . . . . . . . . 1 5 ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 functional description . . . . . . . . . . . . . . . . . . . 3 9 internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 4 10 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 11 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 12 dynamic characteristics . . . . . . . . . . . . . . . . . . 6 13 application information. . . . . . . . . . . . . . . . . . . 7 14 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 15 bare die outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 16 soldering of smd packages . . . . . . . . . . . . . . . 9 16.1 introduction to soldering . . . . . . . . . . . . . . . . . 10 16.2 wave and re?ow soldering . . . . . . . . . . . . . . . 10 16.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 10 16.4 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 10 17 revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 18 legal information. . . . . . . . . . . . . . . . . . . . . . . 13 18.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 18.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 18.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 18.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 19 contact information. . . . . . . . . . . . . . . . . . . . . 13 20 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

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